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Ti's Breakthrough Design for Wearables
Industry's smallest, lowest power battery charger and first fully integrated power module help extend battery run-time
By: Liz McMillan
Sep. 8, 2014 08:45 PM
Delivering power management innovation for ultra-low power designs, Texas Instruments (TI) introduced the industry's smallest, lowest power linear battery charger and a tiny, fully integrated DC/DC power module, which consumes only 360 nA of quiescent current, to help extend battery run-time in wearable electronics, remote sensors and MSP430™ microcontroller-based applications.
Smallest, lowest power linear charger
Designers also can add wireless charging capability to small portable and wearable applications by pairing the bq51003 2.5-W, Qi-compliant wireless charging receiver with the bq25100 linear charger on the same board. Both devices are featured on a new TI Design reference board that measures 75 mm2. In addition, TI has been supporting Humavox, an Israeli company operating in the wireless power technology area, to integrate the bq25100 in its wireless charging solutions for wearable devices and portable healthcare devices under Humavox's ETERNA™ RF-based wireless charging platform.
MicroSiP power modules
The TPS82740A supports output voltages from 1.8 V to 2.5 V, while the TPS82740B supports 2.6 V to 3.3 V in 100-mV steps, which can meet power requirements of microcontrollers, such as TI's new ultra-low power MSP430FR59xx microcontrollers (MCUs), and Bluetooth® low energy solutions, such as the SimpleLink™ CC2540T wireless MCU.
Key benefits of the TPS82740A and TPS82740B:
Ultra-low power design
Availability and pricing
Find out more about TI's ultra-low power solutions by visiting the below links:
About Texas Instruments
The largest 'Internet of Things' event in the world has announced "sponsorship opportunities" and "call for papers."
The 1st International Internet of @ThingsExpo was launched this June at the Javits Center in New York City with over 6,000 delegates in attendance. The 2nd International Internet of @ThingsExpo will take place November 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, California, with an estimated 7,000 plus delegates attending over three days.
@ThingsExpo is co-located with 15th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading IoT industry players in the world. In 2014, more than 200 companies will be present on the @ThingsExpo show floor, including global players and the hottest new technology pioneers.
Sponsorship and Exhibit Opportunities for @ThingsExpo Silicon Valley and New York Are Now Available
For more information on sponsorship, exhibit, and keynote opportunities contact Carmen Gonzalez by email at events (at) sys-con.com, or by phone 201 802-3021. Book both events for additional savings!
@ThingsExpo Silicon Valley (November 4-6, 2014, Santa Clara, CA)
Secure Your VIP Pass to Attend @ThingsExpo Silicon Valley
To take advantage of this opportunity, attendees can use the coupon code "IoTSeptember" and secure their "@ThingsExpo Plus" registration to attend all keynotes and general sessions, as well as a limited number of technical sessions each day of the show, in addition to full access to the expo floor and the @ThingsExpo hackathon.
The registration page is located at the @ThingsExpo site here.
@ThingsExpo New York 2015 'Call for Papers' Now Open
Track 1 - Consumer IoT and Wearables: Smart Appliances, Wearables, Smart Cars, Smartphones 2.0, Smart Travel, Personal Fitness, Health Care, Personalized Marketing, Customized Shopping, Personal Finance, The Digital Divide, Mobile Cash & Markets, Games & the IoT, The Future of Education, Virtual Reality
Track 2 - Enterprise IoT: The Business Case for IoT, Smart Grids, Smart Cities, Smart Transportation, The Smart Home, M2M, Authentication/Security, Wiring the IoT, The Internet of Everything, Digital Transformation of Enterprise IT, Agriculture, Transportation, Manufacturing, Local & State Government, Federal Government
Track 3 - Developer IoT: WebRTC, Eclipse Foundation, Cloud Foundry, Docker & Linux Containers, Node-Red, Open Source Hardware, Leveraging SOA, Multi-Cloud IoT, Evolving Standards, WebSockets, Security & Privacy Protocols, GPS & Proximity Services, Bluetooth/RFID/etc., XMPP, Nest Labs
Download @ThingsExpo Newsletter Today ▸ Here
Chris Matthieu Named @ThingsExpo Tech Chair
Internet of @ThingsExpo named Chris Matthieu tech chair of Internet of @ThingsExpo 2014 Silicon Valley.
Chris Matthieu has two decades of telecom and web experience. He launched his Teleku cloud communications-as-a-service platform at eComm in 2010, which was acquired by Voxeo. Next he built an open source Node.JS PaaS called Nodester, which was acquired by AppFog. His latest startups include Twelephone. Leveraging HTML5 and WebRTC, Twelephone's BHAG (Big Hairy Audacious Goal) is to become the next generation telecom company running in the Web browser. Chris is currently co-founder and CTO of Octoblu.
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